Intercept Technology FAQ

FAQ for Intercept Technology

CORROSION & ITS IMPACT                                                        

“The annual cost of corrosion worldwide is estimated to exceed US$1.8 trillion, which translates to 3 to 4% of the Gross Domestic Product (GDP) of industrialized countries”

“In addition to causing severe damage and threats to public safety, corrosion disrupts operations and requires extensive repair and replacement of failed assets.”

“The Hoar Report emphasized that 25% of the annual cost of corrosion could be saved just by applying existing knowledge on corrosion control. Using this value to calculate possible worldwide savings,… US$ 450 billion in costs can be avoided each year.”

White paper titled “Global Needs for Knowledge Dissemination, Research, and Development in Materials Deterioration and Corrosion Control” issued in 2009 by the World Corrosion Organisation.

Singapore’s 2012 GDP:                             US$274.7 billion.

Corrosion Cost at 3.5% of GDP:                 US$     9.6 billion.

From these statements and figures, it is obvious that an effective corrosion management regime will result in very substantial economic benefits, not to mention the minimisation of disruptions and the improvement in safety related to corroded assets.

Intercept Technology™ developed by AT&T-Bell Labs (now known as Alcatel Lucent Technologies, Inc.) offers an unrivalled range of corrosion control packaging solutions which are superior in performance, cost-effectiveness, packaging process simplicity and environmental care than competition.

INTERCEPT TECHNOLOGY™ SOLUTIONS MEET OR EXCEED THE REQUIREMENTS OF:

• Alcatel-Lucent Specification X-21386 – Corrosion, Moisture Barrier &

                            ESD Protective Packaging

• ASTM B 117-03
• BS 6920 : 2000
• DEF STAN 81-41 ( British Ministry of Defence Packaging Authority )
• ESD Association’s ESD S 11.31
• FED STD 101C, METHOD 3030.1(A1)
• FED STD 313D – definition of “NON-hazardous”
• IDEMA STD M7-98, M13-99 & M11-99
• INTEL Packaging & Crating Specification
• JIS Z 2801 : 2000
• MIL PRF 131K
• MIL SPEC B 81705-C
• MIL STD 1246 C
• NASA SP-R-0022A
• TACOM VCI-free Packaging Program Goals.